Kerui Nano Thermal Insulation Board Technical Data Sheet
| Product name | Nano thermal insulation board | Inspection standards | |
|---|---|---|---|
| Product code | JSGW-950/1050/1100 | ||
| Melting point | ≥1200℃ | ||
| Using temperature | 950℃-1100℃ | ||
| Density (±10%) | 320kg/m3 | GB/T17911-2006 | |
| Specific heat capacity (400℃) | 0.8kJ/kg.k | YB/T4130-2005 | |
| Compressive strength (compression 10%) | 0.3MPa | GB/T 13480-1992 | |
| Linear shrinkage (800℃) | 2% | GB/T17U911-2006 | |
| Thermal conductivity (w/m.k) | 70℃ | 0.019 | YB/T4130-2005 |
| 200℃ | 0.021 | ||
| 400℃ | 0.024 | ||
| 600℃ | 0.031 | ||
| 800℃ | 0.04 | ||
Description of Nano Thermal Insulation Board
Because of the many advantages of nano insulation board, for example, High strength, easy to shape and cut, excellent thermal stability and seismic resistance, not easy to powder at high temperature. The application field of nano insulation board is also very wide, such as: steel field, petrochemical field, glass field, ceramic industry, power, building materials, aviation and other fields.
Excellent chemical stability.
High strength, easy to shape and cut.
Excellent thermal stability.
High temperature resistance.









